SPECIFICATIONS
Part No.: IS200PMLIH1B
Manufacturer: General Electric
Country of Manufacture: United States of America (USA)
Temperature: 0 to 60 oC
Product Type: DLAN Daughter Board
Availability: In Stock
Series: Mark VI
Functional Description
IS200PMLIH1B is a DLAN Daughter Board developed by GE. It is a part of Mark VI system. The board facilitates high-speed communication and data transfer within the control network, ensuring reliable coordination between controllers, processors, and other connected modules.
Features
- The PMLI (DLAN Daughter Board) is designed to extend the communication capabilities of the Mark VI control system by providing an interface for DLAN communication. It typically mounts onto a main processor or control board within the system, acting as an intermediary to manage local network communication among various system components such as turbine control modules, I/O boards, and interface devices.
- The board ensures efficient data exchange and real-time synchronization, which are essential for the smooth and coordinated operation of gas and steam turbine systems. Its robust design allows it to function reliably in demanding industrial environments where precision and uptime are critical.
- DLAN Communication Interface: The primary function of the board is to support Drive Local Area Network (DLAN) communication, enabling high-speed data transfer between control boards and peripheral modules in the Mark VI system.
- Network Signal Processing: The board manages signal encoding, decoding, and communication synchronization, ensuring data integrity and efficient message routing across the network.
- System Integration Support: Designed to operate seamlessly with GE’s Mark VI architecture, the board enhances communication reliability and expands the data exchange capability of the system’s control processor.
- Real-Time Coordination: The DLAN Daughter Board ensures timely and synchronized data sharing between various system elements, contributing to the precise control required in turbine operations.
Design and Construction
- Daughter Board Configuration: Designed as a daughterboard, meaning it connects directly to a main board (typically a processor or control interface board) through a dedicated connector. This modular design allows for easy installation, servicing, and upgrades without replacing the entire main board.
- High-Speed Communication Components: The board incorporates high-performance communication chips and circuitry optimized for fast and stable data transfer within the local control network.
- Compact and Reliable Build: Built with industrial-grade components, offers durability, heat resistance, and long operational life, suitable for continuous operation in turbine and power plant environments.
Product Attributes
- Supports Drive Local Area Network (DLAN) communication.
- Provides high-speed, reliable data transfer between system components.
- Mounts directly onto a main processor or control board.
- Enhances signal integrity and synchronization across the Mark VI system.
- Compact, durable, and designed for industrial-grade performance.
- Ensures robust communication within turbine and automation environments.
The WOC team is always available to help you with your Mark VI requirements. For more information, please contact WOC.
Frequently Asked Questions
What is IS200PMLIH1B?
It is a DLAN Daughter Board developed by GE under the Mark VI series.
What is the purpose of the TMR (Triple Modular Redundant) configuration?
The TMR configuration ensures high reliability and fault tolerance by using three independent controllers that continuously compare outputs. If one controller fails, the other two maintain system operation without interruption, minimizing downtime and risk.
Can the Mark VI system be used with both local and remote I/O?
Yes. The Mark VI system supports local and remote I/O configurations, allowing flexibility in installation based on plant layout and control room location.
What types of I/O racks are used in the Mark VI system?
The system can be configured with single or multiple I/O racks, depending on the complexity and size of the turbine or process being controlled. This modular design allows scalability for various industrial applications.
