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Part Number: IS230TNVBH8A
Manufacturer: General Electric
Series: Mark VIe
Function: Vibration Input Assembly Module
Availability: In Stock
Country of Manufacture: United States (USA)
IS230TNVBH8A is a Vibration Input Assembly Module manufactured by General Electric. It is a part of the Mark VIe Control System. Mark VIe I/O packs include a generic processor board and a data acquisition board that is specific to the type of connected device. Each terminal board's I/O packs digitize the signal, run algorithms, and communicate with the Mark VIe controller. The I/O pack detects faults by combining special circuitry in the data acquisition board with software running on the CPU board.
Other than the standard 37-pin connection, each channel provides additional outputs. The monitored signal is buffered and output as the signal. Each channel has its own BNC connector. Each channel also has a 25-pin (Vib/Position) or 9-pin (Keyphasor) connector that connects to the Bently Nevada 3500 monitoring system. The buffer requirements are as follows:
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What is IS230TNVBH8A?
It is a Vibration Input Assembly Module manufactured and designed by General Electric
What is the role of the terminal board in the I/O pack?
The terminal board serves as the interface for connecting the external devices to the Mark VIe system. It provides the necessary connections and terminals for the signals to be processed and acquired by the I/O pack.
What functions are performed by the I/O pack in the system?
It performs several important functions. It digitizes the incoming signals from the connected devices, runs algorithms for data processing, and facilitates communication with the Mark VIe controller. It acts as an intermediary between the connected devices and the control system.
How does the I/O pack detect faults in the system?
The pack incorporates specialized circuitry in the data acquisition board along with software running on the CPU board to detect faults. This combination allows for fault detection and diagnosis, enabling the system to identify and address any potential issues or abnormalities in the connected devices or signal processing.