IS230SNCIH6A - Digital Input Module

IS230SNCIH6A - Digital Input Module IS230SNCIH6A - Digital Input Module

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SPECIFICATIONS

Part Number: IS230SNCIH6A
Manufacturer: General Electric
Series: Mark VIe
Function: Digital Input Module
Ambient temperature: -30°C to 65 degrees Celsius
Relative humidity: 5 to 95%, non-condensing.
Product type: Module
Availability: In Stock
Country of Manufacture: United States (USA)

Functional Description

IS230SNCIH6A is a Digital Input Module developed by General Electric. It is a part of Mark VIe series. I/O modules are made up of three basic components: the terminal board, the terminal block, and the I/O pack. The terminal board attaches to the cabinet and is available in two basic configurations: S and T. The S-type board has a single set of screws for each I/O point and can condition and digitize the signal with a single I/O pack. Using one, two, or three boards, this board is used for simplex, dual, and dedicated triple modular redundant (TMR) inputs. Typically, the T-type TMR board fans the inputs to three separate I/O packs. The outputs from the three I/O packs are usually voted on by the T-type board hardware.

System I/O pack details

  • The system I/O packs in the Mark VIe system consist of two main components: a generic processor board and a data acquisition board that is specific to the connected device. These I/O packs play a crucial role in digitizing signals, running algorithms, and communicating with the Mark VIe controller.
  • Each terminal board's I/O pack is responsible for converting analog or digital signals into a digital format that can be processed by the controller. It also runs specialized algorithms to perform specific functions based on the connected device's requirements. Communication between the I/O pack and the Mark VIe controller enables seamless data exchange and facilitates efficient control of the industrial process.
  • The I/O pack incorporates special circuitry in the data acquisition board, along with software running on the CPU board, to detect faults. By combining hardware and software mechanisms, the I/O pack can identify and report any anomalies or faults that occur within the connected device. The controller receives and processes these fault status notifications, enabling prompt action and troubleshooting.
  • In cases where both network interfaces are connected, the I/O pack functions as a bidirectional communication channel, transmitting inputs from the connected devices to the controller and receiving outputs from the controller to the devices. This seamless communication ensures smooth and coordinated operation between the controller and the industrial equipment.
  • During operation, each I/O pack can send an identification message to the main controller when prompted. This message contains essential information about the I/O board, including its hardware catalog number, hardware revision, board barcode serial number, firmware catalog number, and firmware version. This identification data assists in accurately identifying and managing the I/O packs within the system.
  • The processor board and data acquisition board of the I/O pack are designed to operate within a temperature range of -30°C to 65°C. These components are equipped with free convection cooling mechanisms, ensuring reliable performance even in demanding environmental conditions.
  • Temperature sensors are integrated into the I/O packs to monitor the temperature levels. These sensors are accurate within a 2°C range, providing reliable temperature data. The temperature readings of each I/O pack are stored in the system's database and can be utilized to trigger alarms or alerts if temperature thresholds are exceeded, allowing for proactive maintenance and preventing potential issues.

System Power Requirements

  • The Mark VIe control cabinet is designed to be powered by various sources, providing flexibility to accommodate different installation requirements. Before entering the Mark VIe enclosure, each power input source, whether it is a DC or AC source, must pass through its own external 30 A two-pole thermal magnetic circuit breaker. These breakers are essential for ensuring proper protection and compliance with site codes and regulations.
  • The specific power input sources can vary, but commonly used options include 24 V DC, 125 V DC, and 120/240 V AC. The power distribution hardware within the Mark VIe system is configured to accommodate the required power sources. It's important to note that not all inputs may be available in a particular configuration, as it depends on the specific setup and requirements of the control system.
  • For the operation of the control electronics, the input power is converted to 28 V DC. This 28 V DC power is then distributed as needed for various tasks, such as I/O signal processing. Additionally, it is important to consider the current draw of external solenoids when calculating the total current requirements. The documentation provides specific notes and guidelines on how to factor in the current supplied to external solenoids, ensuring an accurate assessment of the power needs.
  • It's worth noting that the operation of external solenoids within the control cabinet generates heat. In a typical 4200 mm (165 in) TMR (Triple Modular Redundant) cabinet, when fully loaded, the heat loss can be around 1500 W. This information is crucial for thermal management and ensuring proper cooling systems are in place to maintain optimal operating conditions within the control cabinet.

WOC is happy to assist you with any of your GE automation requirements. Please contact us by phone or email for pricing and availability on any parts and repairs.

FREQUENTLY ASKED QUESTIONS

What is IS230SNCIH6A?
It is a Digital Input Module developed by General Electric.

What is the temperature range for operation of the processor board and data acquisition board in the I/O pack?
The processor board and data acquisition board of the I/O pack are rated for -30°C to 65°C operation with free convection cooling.

What is the accuracy of the temperature sensor in the I/O packs?
The temperature sensor in the I/O packs is accurate to within 2°C.

Can the temperature of each I/O pack be monitored and used to trigger an alarm?
Yes, each I/O pack temperature is stored in the database and can be used to trigger an alarm.