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Part No.: IS400JPDHG1ABBFA
Manufacturer: General Electric
Country of Manufacture: United States of America (USA)
Mounting: DIN-Rail
Temperature: -30 to 65oC
Size: 10.16 cm wide x 33.02 cm high
Product Type: High Density Power Distribution Board
Availability: In Stock
Series: Mark VIe
IS400JPDHG1ABBFA is a High Density Power Distribution Board developed by GE. It is a part of Mark VIe control system. The High Density Power Distribution (JPDH) board plays a pivotal role in efficiently delivering 28 V dc power within the system, catering to multiple Mark VIe I/O packs and Ethernet switches from a primary 28 V dc power source. Let's delve deeper into its key functionalities and capabilities:
The board efficiently supplies 28 V dc power to a network comprising 24 Mark VIe I/O packs and 3 Ethernet switches. Its design incorporates expandability, allowing additional JPDHs to be connected in a daisy-chain configuration. This expandability feature facilitates the provisioning of power to additional I/O packs as required, ensuring scalability within the system's architecture.
To safeguard each circuit associated with an I/O pack connector, it incorporates positive temperature coefficient (PTC) fuse devices. These fuses act as protective measures, guarding against overcurrent situations and bolstering safety by preventing electrical faults within the system.
Specifically tailored for Triple Modular Redundant (TMR) I/O packs, the JPDH is optimized to efficiently distribute 28 V dc power while minimizing spatial utilization. This configuration ensures reliable power delivery to TMR modules within the system.
The JPDH offers daisy-chain connectivity through the unfused J1X connector, allowing multiple JPDHs to be linked together. However, it is imperative for users to incorporate suitable branch circuit protection when connecting multiple JPDHs. This precautionary measure is vital to uphold system integrity and safety. Notably, each pin of the 6-pin J1 connector is rated at 13 A, emphasizing the importance of compliance with rated specifications.
The 6-pin J1 connector strategically allocates three separate 28 V dc feeds across different pins, ensuring triple redundancy for the R, S, and T feeds. Meanwhile, the return current, shared among the TMR and daisy-chain feeds, is channeled through the remaining three pins of the connector. This meticulous distribution of power feeds ensures redundancy and consistency in power delivery across the system.
The WOC team is always available to help you with your Mark VIe requirements. For more information, please contact WOC.
What is IS400JPDHG1ABBFA?
It is a High Density Power Distribution Board developed by GE under the Mark VIe series.
What protective measures are implemented for the I/O pack circuits?
Each circuit responsible for powering the I/O packs is equipped with a positive temperature coefficient (PTC) fuse device. These fuse devices serve as branch circuit protection, ensuring safeguarding against overcurrent situations and enhancing safety within the system.
How does the JPDH provide power to the Ethernet switches?
In addition to the output circuits for the I/O packs, the board features three identical unfused output circuits specifically dedicated to providing power to each individual Ethernet switch. These circuits ensure consistent and reliable power delivery to the switches within the system.
What is the purpose of the identical output circuits for the Ethernet switches?
The identical output circuits tailored for the Ethernet switches on the board are designed to supply uninterrupted and consistent power to these essential components, maintaining their operational efficiency and reliability within the overall system architecture.
How does the JPDH ensure uniform and protected power distribution to both I/O packs and Ethernet switches?
Through its allocation of identical output circuits equipped with protective PTC fuse devices for I/O packs and dedicated unfused output circuits for Ethernet switches, the JPDH ensures not only uniform but also protected power distribution, guaranteeing reliable performance and safety across all connected components.
