SPECIFICATIONS
Part No.: IS230TEVF1AG01
Manufacturer: General Electric
Country of Manufacture: United States of America (USA)
Size: 3.25 in. x 1.65 in. x 4.78 in.
Temperature Operating: -30 to 65 o C
Technology: Surface-mount
Product Type: I/O Module
Availability: In Stock
Series: Mark VIe
Functional Description
IS230TEVF1AG01 is a I/O Module developed by GE. It is part of Mark VIe control system. The terminal board serves as the interface between the external signals and the internal components of the system. It is designed to be mounted within the cabinet and is available in two primary variants S and T.
Features
- S-Type Terminal Board: This variant features a single set of screws for each I/O point. It facilitates the connection of external signals and allows a single I/O pack to condition and digitize the signal. The S-type board is versatile and can be used for simplex, dual, and dedicated triple modular redundant (TMR) inputs. Depending on the redundancy requirements, one, two, or three boards may be utilized.
- T-Type Terminal Board: In contrast, the T-type terminal board is specifically designed for triple modular redundant (TMR) applications. It fans the inputs to three separate I/O packs, providing redundancy and fault tolerance. Typically, the T-type board hardware facilitates voting of outputs from the three I/O packs, ensuring reliability and consistency in critical operations.
- The terminal block is an essential component of the terminal board, facilitating the secure connection of wires or cables from external devices. It provides a reliable and organized means of routing signals to the I/O packs for processing and analysis.
- The I/O pack is responsible for conditioning and digitizing the signals received from the terminal board. It converts analog signals into digital data, which can then be processed and utilized by the system for various control and monitoring purposes. In the case of TMR configurations, the I/O packs work in conjunction with the terminal board to ensure redundancy and fault tolerance, enhancing the system's reliability and robustness.
Characteristics
- Terminal Blocks for I/O Wiring: Serve as the connection points for input and output wiring. These blocks provide a secure and organized means of terminating wires or cables from external devices, ensuring reliable signal transmission. They are designed to accommodate various wire sizes and types, offering flexibility in wiring configurations.
- Mounting Hardware: Essential for securely installing the terminal boards within the cabinet or enclosure. This hardware includes screws, brackets, and other fasteners designed to hold the terminal boards firmly in place. Proper mounting ensures stability and longevity of the I/O modules, even in challenging operating environments.
- Input Isolation and Protection:Safeguard the I/O modules and associated equipment from electrical faults and disturbances. Isolation barriers prevent the propagation of electrical faults, ensuring that a fault in one part of the system does not affect other components. Additionally, protection circuits shield the modules from overvoltage, overcurrent, and other potentially damaging conditions, enhancing the reliability and longevity of the system.
- I/O Pack Connectors: Facilitate the connection between the terminal boards and the I/O packs. These connectors ensure secure electrical connections, enabling efficient signal transfer between the terminal boards and the processing units. They are designed to withstand repeated insertions and removals, providing a reliable interface for seamless integration within the system architecture.
- Unique Electronic ID: Each I/O module is assigned a unique electronic ID, which serves as a digital identifier for the module within the system. This ID allows for easy identification and tracking of individual modules during installation, maintenance, and troubleshooting processes
I/O Packs in Mark VIe
- Generic Processor Board: The generic processor board serves as the computational backbone of the I/O pack. It is equipped with processing capabilities that enable it to execute various algorithms and tasks required for signal conditioning and analysis. This board provides the necessary computing power to handle a wide range of input signals and processing requirements, ensuring flexibility and adaptability in diverse industrial environments.
- Data Acquisition Board: Complementing the generic processor board, the data acquisition board is uniquely designed to interface with the type of connected device. Whether it's sensors, actuators, transducers, or other industrial equipment, the data acquisition board is optimized to efficiently capture and convert the signals from these devices into digital format. By tailoring the data acquisition board to the specific requirements of each device, the Mark VIe system ensures optimal performance and accuracy in signal acquisition and processing.
- Signal Digitization and Algorithm Execution: Once the analog signals are received from the connected devices, the I/O packs on each terminal board undertake a series of tasks to digitize the signals and perform necessary algorithms. This includes signal conditioning, filtering, amplification, and any other preprocessing steps required to enhance the quality and reliability of the digital data. The generic processor board executes predefined algorithms or custom logic programmed to meet the specific needs of the application, ensuring precise and timely processing of the digitized signals.
- Communication with Mark VIe Controller: Following signal processing and algorithm execution, the digitized data is transmitted from the I/O packs to the Mark VIe controller. This communication is facilitated through robust communication protocols, ensuring fast and reliable data transfer between the I/O packs and the controller. By seamlessly interfacing with the controller, the I/O packs enable real-time monitoring, control, and decision-making, contributing to the overall efficiency and effectiveness of the industrial system.
The WOC team is always available to help you with your Mark VI requirements. For more information, please contact WOC.
Frequently Asked Questions
What is IS230TEVF1AG01?
It is a I/O Module developed by GE under the Mark VIe series.
What are the operating temperature specifications for the I/O pack's processor board and data acquisition board?
The processor board and data acquisition board are rated for operation within the temperature range of -30oC to 65oC with free convection cooling.
Is there a temperature sensor within the I/O pack, and how accurate is it?
Yes, the I/O packs are equipped with a temperature sensor. The temperature sensor is accurate to within 2oC.
How is the temperature information utilized within the system?
The temperature of every I/O pack is available in the database. This temperature data can be utilized to generate alarms, providing early warning of potential overheating or environmental issues.
