SPECIFICATIONS
Part No.: IS230PCCAH1B
Manufacturer: General Electric
Country of Manufacture: United States of America (USA)
Trip solenoids 3 solenoids per TRPG
Solenoid rated voltage: 125 V dc
Solenoid rated current: 1 A
Product Type: Core Analog I/O module
Availability: In Stock
Series: Mark VIe
Functional Description
IS230PCCAH1B is a Core Analog I/O module developed by GE. It is a part of Mark VIe control system. The I/O packs in the Mark VIe control system play a vital role in signal processing, fault detection, communication, and system monitoring. By combining specialized hardware and software components, these packs ensure reliable operation and facilitate efficient management of connected devices. The integration of temperature sensors further enhances system reliability by enabling proactive monitoring and mitigation of potential thermal issues.
Features
- Components: Each I/O pack in the Mark VIe control system comprises a generic processor board and a data acquisition board tailored to the connected device. These components work together to digitize signals, execute algorithms, and facilitate communication with the Mark VIe controller.
- Fault Detection Mechanism: Integrates a fault detection system that combines specialized circuitry in the data acquisition board with software running on the Central Processing Unit (CPU) board. This comprehensive approach enables the detection and identification of faults within the I/O pack, ensuring system integrity and reliability.
- Transmission of Fault Status: Fault status detected is transmitted to the controllers, providing crucial information for system monitoring and maintenance. This real-time feedback allows for prompt troubleshooting and corrective action, minimizing downtime and optimizing system performance.
- Dual Network Interface Communication: I/O packs communicate with the Mark VIe controller via both network interfaces if connected. This redundancy enhances communication reliability and ensures uninterrupted data exchange between the I/O packs and the controller, even in the event of network failures or disruptions.
- Identification Message Transmission: Each pack sends an identification message (ID packet) to the main controller upon request. This packet contains essential information, including the hardware catalog number, hardware revision, board barcode serial number, firmware catalog number, and firmware version. This data facilitates accurate identification and tracking of I/O pack components within the system.
- Temperature Monitoring:Equipped with temperature sensors that provide accurate temperature readings within 2oC. These temperature readings are continuously monitored and logged in the system database. If the temperature exceeds predefined thresholds, an alarm can be generated, alerting operators to potential overheating issues and enabling proactive maintenance actions.
- Integrated Design: Embodies an integrated design philosophy, consolidating four separate circuit boards into a single physical assembly. This integrated approach optimizes space utilization and simplifies the installation process, facilitating seamless integration within the control system architecture.
- Least Replaceable Unit: Due to its intricately integrated structure, the module is recognized as the least replaceable unit within the control system. This designation stems from the inherent complexity involved in isolating a failure to a single board within the module.
- Complexity Management: Managing the complexity associated with the module is paramount to ensuring the reliability and functionality of the control system. While the module offers enhanced efficiency and functionality, its integrated nature necessitates meticulous maintenance and troubleshooting procedures to address any potential issues or failures effectively.
- System Reliability: Despite its complexity, the module plays a role in enhancing the overall reliability and performance of the control system. By consolidating multiple functions into a single unit, the module minimizes points of failure and simplifies system management, thereby bolstering system reliability and uptime.
- Maintenance Considerations: Given the intricacies involved, maintenance requires a proactive approach focused on preventive measures and regular inspections. Implementing routine maintenance protocols can help mitigate potential risks and prolong the lifespan of the module, thereby maximizing system efficiency and longevity.
Wiring
- Shield Termination Points: The JGPA provides forty-eight shield termination points, marked in green, to ensure proper grounding and shielding of cables. Shield termination is essential for minimizing electromagnetic interference and maintaining signal integrity within the control system.
- 24 V DC Output Terminals: In addition to shield termination points, the JGPA board also offers twelve 24 V DC output terminals, marked in orange. These terminals are specifically designed to supply power to 4-20 mA transmitters, facilitating the operation of various sensors and devices within the control system.
- Wiring Procedure: During the wiring process, cables are connected to the appropriate terminals on both the module and the JGPA board. Proper cable routing and termination techniques are employed to ensure secure and reliable connections.
- Integration with Control System:Once the wiring connections are established, the module and JGPA board are integrated into the broader control system setup. This integration allows for seamless communication and interaction between different components, facilitating efficient operation and control of industrial processes.
The WOC team is always available to help you with your Mark VIe requirements. For more information, please contact WOC.
Frequently Asked Questions
What is IS230PCCAH1B?
It is a Core Analog I/O module developed by GE under the Mark VIe series.
What components make up an I/O pack in the Mark VIe control system?
Each I/O pack consists of a generic processor board and a data acquisition board tailored to the connected device. These components work together to digitize signals, execute algorithms, and communicate with the Mark VIe controller.
How does the I/O pack provide fault detection?
Fault detection in the I/O pack is achieved through a combination of specialized circuitry in the data acquisition board and software running on the Central Processing Unit (CPU) board. This comprehensive approach ensures the timely detection and identification of faults within the I/O pack, enhancing system reliability.
How is fault status transmitted from the I/O pack to the controllers?
The Fault status detected is transmitted to the controllers, providing critical information for system monitoring and maintenance. This real-time feedback enables operators to promptly address issues, minimizing downtime and optimizing system performance.
